DAT (3,5-Diamino-1,2,4-triazole, >98.0%) Powder as Electrolyte Additive for Battery and Electrodeposition, CBEEADAT

In the field of electrochemistry, 3,5-Diamino-1,2,4-triazole (DAT) is a highly effective organic inhibitor used to control the electrodeposition of metals, most notably Copper (Cu). It is utilized in the microelectronics industry (for "damascene" copper plating) and in battery technology to ensure uniform, defect-free metal surfaces. Its primary role is to suppress the growth of high-energy crystal facets, thereby preventing the formation of dendrites and ensuring a "leveling" effect.

DAT functions as a leveling agent and grain refiner through a multi-step adsorption process: (1) Chemical Adsorption: The nitrogen atoms in the triazole ring and the lone pairs on the amino (-NH2) groups have a high affinity for transition metal surfaces. DAT forms a coordinate bond with the metal atoms, creating a thin, protective molecular film. (2) Blocking Active Sites: Once adsorbed, DAT acts as a physical barrier. It blocks the "active sites" or kinks on the electrode surface where metal ions would naturally prefer to deposit. (3) Overpotential Increase: By blocking these sites, DAT increases the charge-transfer resistance. This forces the electrochemical system to operate at a higher overpotential to continue deposition, which thermodynamically favors the nucleation of many small grains rather than the growth of a few large, sharp crystals.

Copper Damascene Processing: In the fabrication of integrated circuits, copper must be plated into tiny trenches without leaving voids. DAT is used alongside other additives (like accelerators). It adsorbs more heavily at the "mouth" of the trench, slowing down deposition there while allowing the bottom of the trench to fill rapidly.

Zinc-Ion and Lithium-Metal Batteries: Dendrite growth is a major failure mode for metal-anode batteries. Adding small amounts of DAT to the electrolyte ensures that zinc or lithium plates smoothly. It specifically "crawls" toward any emerging sharp points (tips) due to the higher local electric field, adsorbs there, and shuts down the growth of that point before it can become a dendrite.

Corrosion Inhibition: Beyond active plating, DAT is a premier corrosion inhibitor for copper and brass. It remains stable in both acidic (e.g., H2SO4) and neutral environments, forming a hydrophobic layer that prevents dissolved oxygen and moisture from reaching the metal surface.

Part Number	CBEEADTA (C-BEEA-DTA)
CAS	1455-77-2
Chemical Formula	C2H5N5
Appearance	White powder
Purity	>98.0%
Molecular Weight	99.09 g/mol
Package Size	50 g/bottle (100g, 500g, and 1 kg also can be supplied upon request)

Notes: Please try to store the DAT powder in the dry place. 

References: 

1. T. T. H. Hoang, et al. Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis, ACS Catal. 2017, 7, 5, 3313–3321.
2. K. G. Schmitt, et al. In Situ Surface-Enhanced Raman Spectroscopy of the Electrochemical Reduction of Carbon Dioxide on Silver with 3,5-Diamino-1,2,4-Triazole, J. Phys. Chem. C 2014, 118, 31, 17567–17576. 
3. T. T. H. Hoang, et al., High Activity Oxygen Evolution Reaction Catalysts from Additive-Controlled Electrodeposited Ni and NiFe Films, ACS Catal. 2016, 6, 2, 1159–1164.