ECS-SS Micro-Speed (1-500um/s) Dip Coater with Drying Oven (100℃), ESSMSDCDO
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A Micro-Speed Dip Coater with Drying Oven is a specialized thin-film fabrication unit designed for research where ultra-thin, uniform coatings are required from low-viscosity solutions or slurries.
Micro-Speed Drive: Unlike standard coaters, a micro-speed unit uses high-resolution stepper motors or piezo-drives to achieve withdrawal speeds as low as 0.1 um/s. This is essential for the "Capillary Regime" of coating, where the film thickness is extremely thin (<100 nm). (2) Integrated Oven: The heating chamber is typically positioned above the dipping beaker. As the substrate is withdrawn, it enters a temperature-controlled environment (up to 200°C or higher). (a) Solvent Management: Immediate heating ensures that the solvent (like NMP or Terpineol) evaporates at a rate that matches the withdrawal speed, locking the particles (e.g., YSZ or GDC) in place. (b) Pre-heating: Some systems allow the substrate to be pre-heated before dipping to alter the wetting behavior.
Dip Coating Process Sketch and Working Mechanism
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