Sputtering deposits dense, adherent thin films by ejecting atoms from a solid target with energetic ions — the workhorse PVD technique for current collectors, catalyst layers, seed layers, and model electrodes in electrochemistry research. Compared with thermal evaporation, sputtering reaches a wider range of materials (metals, alloys, oxides, nitrides) and gives better step coverage and adhesion on rough or porous substrates such as gas-diffusion layers, separators, and patterned silicon.
This collection groups the hardware a lab needs to set up a working sputter line, from the deposition chamber itself to the supporting vacuum and metrology pieces.
Sputtering modes commonly used in electrochemistry labs
-
DC magnetron sputtering — for conductive targets: Cu, Ni, Ti, Pt, Au, stainless steel. Used for thin-film current collectors and model planar electrodes.
-
RF magnetron sputtering — required for insulating targets: oxides (LLZO, LiPON, Al2O3, TiO2), nitrides, and most solid-electrolyte films.
-
Reactive sputtering — metal target plus O2 or N2 background gas to grow oxide or nitride films (for example TiN diffusion barriers, NiOx hole-transport layers, or LiPON written from a Li3PO4 target in N2).
-
Co-sputtering — two or more targets fired simultaneously to tune alloy composition or dope a host film without remaking the target.
Typical research uses
- Thin-film model electrodes for fundamental kinetic, impedance, and operando studies, where mass loading and morphology must be tightly controlled.
- Patterned current collectors and interconnects for microbatteries, on-chip electrochemical cells, and 3-electrode microfabricated devices.
- Catalyst-layer deposition for fuel-cell and electrolyzer benchmarking, including ultra-low-loading Pt, IrOx, and RuOx layers on carbon papers and PTLs.
- Solid-state battery interlayers — Li-ion-conducting LiPON, garnet-side wetting layers, and metallic interlayers between Li metal and ceramic electrolytes.
- Seed and adhesion layers (Ti, Cr, TiN) under thicker electroplated or evaporated functional films.
Choose the chamber configuration that matches your target inventory: DC-only is enough for purely metallic work; RF or DC+RF is required if you plan to deposit oxide solid electrolytes, oxide catalysts, or dielectric stacks. For routine substrate prep before deposition, see cleaning equipment; for downstream characterization of film thickness and roughness, see characterization equipment.
