Expanded Copper Mesh Chips (D=10-16 mm, T = 0.05-0.1 mm) as Anode-Free Battery Current Collector, 100 pcs/bag, CAFBCCECMC
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Expanded copper mesh chips (precision-cut pieces or discs of expanded copper mesh) represent an advanced 3D porous substrate architecture utilized in anode-free (zero-excess) battery configurations—including advanced aqueous zinc-ion, lithium, and sodium systems. Unlike flat, planar copper foil chips, expanded mesh features a diamond-shaped or rhombic open-mesh geometry created by simultaneously slitting and stretching solid copper sheet stock.
The key structural and electrochemical advantages of expanded copper mesh chips in anode-free cells are: (1) 3D Porous Architecture & Reduced Local Current Density: The open-mesh structure drastically increases the electrochemically active surface area compared to a smooth foil. By spreading the ionic flux over an expansive 3D network, the local current density (mA/cm^2) is substantially lowered, preventing the high-current hotspots that typically drive dendritic metal electrodeposition during initial charging. (2) Effective Accommodation of Volume Expansion: Anode-free cells rely on direct metal plating onto the substrate during charge and complete stripping during discharge. The spring-like, flexible architecture of expanded mesh accommodates the localized mechanical stress and volume breathing of the plated metal layer, reducing internal delamination and mechanical degradation. (3) Enhanced Electrolyte Permeability and Wettability: The open apertures of the mesh allow unhindered electrolyte transport through the substrate thickness, ensuring that both sides of the mesh participate uniformly in charge transfer and metal nucleation.
| Part Number |
CAFBCCECMC (C-AFBCC-ECMC) |
| Purity |
>99.99% |
| Sample Dimension |
Diameter: 10, 12, 14, and 16 mm Thickness: 0.05 and 0.1 mm (other thickness in 0.05-0.5 um are also available upon request) |
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