Mist Chemical Vapor Deposition (Mist CVD) (also named Ultrasonic Spray Pyrolysis) is a solution-based thin-film deposition technique that operates at atmospheric pressure, making it a highly cost-effective and energy-efficient alternative to traditional vacuum-based CVD. By atomizing liquid precursors into a fine aerosol (mist), this method allows you to deposit high-quality, conformal functional films onto complex surfaces—ideal for protecting sensitive battery materials like NFPP and NMC.

Mist CVD bridges the gap between liquid-phase processing and gas-phase deposition. (1) Atomization: An ultrasonic transducer (typically 1.6–2.4 MHz) creates a fine mist of droplets (usually 1–3 um in diameter) from a liquid precursor solution. (2) Transportation: A carrier gas (N2, Ar, or air) carries the mist into a heated reaction zone. (3) Leidenfrost Effect: As the mist reaches the heated substrate (typically 200℃ to 500℃, a vapor cushion forms beneath the droplets. This prevents the droplets from "splashing" and ensures they decompose chemically near or on the surface. (4) Conformal Film Growth: The precursor decomposes to form a solid film, while solvent vapors and byproducts are swept away by the exhaust.

References:

A. Kuddus, et al., Mist chemical vapor deposition of crystalline MoS2 atomic layer films using sequential mist supply mode and its application in field-effect transistors, Nanotrchnology, 2022, 33, 045601.

J. Park, et al., High-Performance Zinc Tin Oxide Semiconductor Grown by Atmospheric-Pressure Mist-CVD and the Associated Thin-Film Transistor Properties, ACS Appl. Mater. Interfaces 2017, 9, 24, 20656–20663

S. Yao, et al., Mist CVD technology for gallium oxide deposition: A review, Materials Today Physics, 2024, 49, 101604.