ECS-SS 4-Positions Angle-Adjustable Dip Coater, ESS4PAADC
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A 4-Positions Angle-Adjustable Dip Coater is a specialized thin-film deposition system designed to overcome the limitations of standard vertical dipping. By allowing the substrate to enter the solution at a specific angle (typically 0° to 90°), this machine provides a unique method to control film thickness, meniscus behavior, and coating uniformity on both sides of a substrate.
In standard vertical dipping, gravity and surface tension pull the liquid straight down, often leading to a "wedge effect" (thicker at the bottom). Adjusting the angle changes the physics of the meniscus: (1) Meniscus Control: A tilted entry changes the contact angle of the liquid on the substrate. This can help "stretch" the meniscus, leading to thinner and more uniform coatings at higher speeds than vertical dipping allows. (2) Single-Side Coating Bias: If a high-quality coating on one side of a Ni-YSZ support is required, dipping at an angle can change how the liquid drains off the "back" side compared to the "front" side. (3) Asymmetric Substrates: For substrates with complex geometries or surface textures, an angled entry prevents air bubbles from being trapped in the pores—a common failure point in SOFC electrolyte deposition.
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