Atomic layer deposition (ALD) builds ultrathin, conformal oxide and nitride coatings one self-limited monolayer at a time — the technique of choice when you need pinhole-free films on porous electrodes, high-aspect-ratio scaffolds, or sensitive cathode powders. This collection groups the precursor delivery hardware, reactor platforms, and consumables used to run thermal and plasma-enhanced ALD at lab and pilot scale for battery, fuel-cell, electrolyzer, and broader electrochemistry research.
ALD's value in electrochemistry comes from three properties that no other vapor-phase route delivers together: angstrom-level thickness control, complete conformality on rough or porous geometries, and self-limiting surface chemistry that decouples coverage from line-of-sight. Typical electrochemistry use cases include Al2O3 / ZrO2 / TiO2 surface layers on layered, spinel, and olivine cathode particles to suppress electrolyte oxidation and transition-metal dissolution; LiPON, Li3PO4, or lithium-containing oxides as solid-electrolyte interlayers; protective coatings on lithium-metal and silicon anodes; conformal catalyst supports for electrolyzer and fuel-cell electrodes; and pinhole repair on thin-film current collectors.
Hardware in this section spans the full ALD workflow:
- Thermal ALD reactors for standard oxide and nitride chemistries on flat substrates, foils, and small powder loads
- Plasma-enhanced ALD systems for low-temperature processes and nitride films where thermal precursors are unreactive
- Powder ALD configurations (rotary, fluidized-bed, agitated tray) for coating cathode and anode particles in batch quantities relevant to coin-cell and pouch-cell prototyping
- Precursor delivery accessories: bubblers, vapor-draw cylinders, heated manifolds, and inert-atmosphere loading hardware for moisture- and air-sensitive metal-organic precursors
- Consumables and spares: reactor liners, gaskets, valves, and exhaust traps sized for typical lab throughput
ALD sits alongside the other vapor-phase routes in this catalog. If you need conformality and sub-nanometer thickness control, ALD is the right starting point. If your target is thicker films, faster throughput, or heavier loadings, see the broader Vapor-Phase Synthesis section for chemical and physical vapor deposition platforms, and the parent Synthesis Equipment hub for solution-phase, mechanochemical, and high-temperature alternatives.
