ECS-CY Extra-Large Spin Coater with Vacuum Chunk and Heating Function (Max. 780 mm, 1500 rpm, 200℃), ECYELSCVCH
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In semiconductor processing and thin-film research, a large-format spin coater transitions from standard 2-inch or 4-inch wafer handling into processing large substrates. These systems typically handle panels, photomasks, or wafers ranging from 300 mm (12 inches) up to 600 mm * 600 mm (24 inches) square. Scaling up the physical footprint introduces strict fluid dynamic and mechanical engineering challenges, altering how the system maintains film thickness uniformity (≤±1-2%).
When moving from small-scale lab coaters to large-format systems, the physics changes fundamentally across three main areas:
(1) Aerodynamic Drag and Turbulence Management: As the substrate diameter doubles, the linear velocity at the outer edge spikes dramatically at a given RPM (v = w * r). This high edge-speed generates turbulent air currents across the substrate: Turbulence causes uneven solvent evaporation, resulting in "edge bead" defects, ripples, and variations in film thickness, therefore large coaters utilize closed-bowl configurations or rotating lids/shrouds that spin with the substrate. This isolates the fluid boundary layer, forcing the air to move synchronously with the solution to guarantee a smooth, laminar evaporation front.
(2) High-Torque Servo Dynamics: Large glass panels or 300 mm+ silicon wafers possess substantial mass and rotational inertia. To achieve highly repeatable film thicknesses, the system cannot slowly ramp up to speed. It requires high-torque, brushless DC servomotors paired with precise encoder loops. These motors must accelerate heavy loads up to targets (e.g., 1000 to 4000 RPM) within 0.5 to 1.5 seconds, maintaining a constant velocity without shaking or vibrating the tool chassis.
(3) Custom Vacuum Chuck Engineering: Small wafers stay centered via small, generic vacuum rings, while large or non-circular panels (such as square flat-panel display glass) require heavy-duty, customized chucks: (i) Material Selection: Precision-machined from hard-anodized aluminum, Delrin, or specialized PEEK to minimize thermal transfer. (ii) Surface Layout: Integrated with multi-zone concentric vacuum grooves or O-ring seals extending near the outer margins to prevent the edges of flexible substrates from flexing upward under high centrifugal force. (iii) Symmetry: Heavily counter-balanced to prevent axis wobbling.
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