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ECS-SL Large Spin Coater with Vacuum Chunk (Max. 550 mm, 2000 rpm), ESLLSPCVC

ECS-SL Large Spin Coater with Vacuum Chunk (Max. 550 mm, 2000 rpm), ESLLSPCVC

In Stock SKU: ESLLSPCVC
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In semiconductor processing and thin-film research, a large-format spin coater transitions from standard 2-inch or 4-inch wafer handling into processing large substrates. These systems typically handle panels, photomasks, or wafers ranging from 300 mm (12 inches) up to 600 mm * 600 mm (24 inches) square. Scaling up the physical footprint introduces strict fluid dynamic and mechanical engineering challenges, altering how the system maintains film thickness uniformity (≤±1-2%).

When moving from small-scale lab coaters to large-format systems, the physics changes fundamentally across three main areas:

(1) Aerodynamic Drag and Turbulence Management: As the substrate diameter doubles, the linear velocity at the outer edge spikes dramatically at a given RPM (v = w * r). This high edge-speed generates turbulent air currents across the substrate: Turbulence causes uneven solvent evaporation, resulting in "edge bead" defects, ripples, and variations in film thickness, therefore large coaters utilize closed-bowl configurations or rotating lids/shrouds that spin with the substrate. This isolates the fluid boundary layer, forcing the air to move synchronously with the solution to guarantee a smooth, laminar evaporation front.

(2) High-Torque Servo Dynamics: Large glass panels or 300 mm+ silicon wafers possess substantial mass and rotational inertia. To achieve highly repeatable film thicknesses, the system cannot slowly ramp up to speed. It requires high-torque, brushless DC servomotors paired with precise encoder loops. These motors must accelerate heavy loads up to targets (e.g., 1000 to 4000 RPM) within 0.5 to 1.5 seconds, maintaining a constant velocity without shaking or vibrating the tool chassis.

(3) Custom Vacuum Chuck Engineering: Small wafers stay centered via small, generic vacuum rings, while large or non-circular panels (such as square flat-panel display glass) require heavy-duty, customized chucks: (i) Material Selection: Precision-machined from hard-anodized aluminum, Delrin, or specialized PEEK to minimize thermal transfer. (ii) Surface Layout: Integrated with multi-zone concentric vacuum grooves or O-ring seals extending near the outer margins to prevent the edges of flexible substrates from flexing upward under high centrifugal force. (iii) Symmetry: Heavily counter-balanced to prevent axis wobbling.

Part Number
  • ESLLSPCVC (ESL-LSC-VC)
Power
  • AC220V±10%, single phase, 50/60Hz, 1000 W

Chamber & Chuck Features


  • Chamber Materials: NPP 
  • Vacuum Chunk Material: PTFE (for bottom heating version, normally Al vacuum plate will be used)
  • Chamber Size: ~600 mm (the acceptable round sample sizes can be up to 550 mm or square sample: 400*400mm);
  • Vacuum Chunk Size: 500 mm (standard version).

                   

      Rotation Speed & Time
      • Max. 2000 rpm, adjustable
      • Rotation Stability:  ± 0.2% (Servo motor that can support 1.5 kg sample rotated at 2000 rpm)
      • Programmable 26 segments and each segment have 100 procedures for parameter setting. 
      • Acceleration speed can be set
      • Setting Time: 1-9999 s
      Automatic Solution Dripping
      • The automatic solution feeding function for droplet dripping is available.

               

      Heating Function (Optional)
      • The bottom heating function is available for wet coating film dying
      • The maximum heating temperature is 200 °C. 
      Vacuum Pump (Optional)
      • The oilless vacuum pump (ESOVP) can be considered for vacuum suction (-0.093 MPa). 

             

      • The vacuum sensor is available on the spin coater to avoid sample was thrown away when vacuum level is not enough.  
      Certification
      • CE certified
      • UL and CSA certification is available upon request at extra cost
      • One year warranty and lifetime technical support and service.
      Dimension
      • W950 * D840 * H1150 mm
      Weight
      • ~120 kg

       

      References:

      P. Jiang, et al., Large-Scale Fabrication of Wafer-Size Colloidal Crystals, Macroporous Polymers and Nanocomposites by Spin-Coating, J. Am. Chem. Soc. 2004, 126, 42, 13778–13786

      M.D. Tyona, et al., A comprehensive study of spin coating as a thin film deposition technique and spin coating equipment, Advances in Materials Research, 2013, 2, 181-193

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